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Film Adhesion

Brand:Frontier Semiconductor

Place of Origin:U.S.A

Model:Film Adhesion

Keyword tag:Film Stress;FEOL Electrical Characterization?;Thin wafer metrology?;Film Adhesion
021-37018108Online Message

Film Adhesion

Film adhesion testing of thin films and stacks on substrates for material evaluation

3DIC TSV and BWS TTV
Film Stress
FEOL Electrical Characterization 
Thin wafer metrology 
Film Adhesion

Film adhesion testing
of thin films and stacks on substrates
for material evaluation. 
FSM offers two techniques suitable for low and medium adhesion strength tests.

 

 

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Contact our application team immediately: 021-37018108, info@boyuesh.com 

 

 

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